Internships › Hardware Engineering › New York

Hardware Engineering internships in New York

26 open student roles in hardware engineering in New York, from internships to co-ops and research. That includes 14 co-ops and 1 research position. 3% list pay or say they are paid. The most common start terms are Summer 2027 and Spring 2027. Employers with the most openings: AMD, GE Vernova, Google, Citadel Securities and D3 Embedded.

• Two Sigma New
  Hardware Engineering Intern
  NYC · Summer 2027
  Open posting
• Tesla
  Factory Firmware Integration Intern - Energy Engineering
  Buffalo, NY · Winter 2027
  Open posting
• Micron Technology New
  Intern - Semiconductor Research & Technology Development
  Albany, NY · research
  Open posting
• Google
  Hardware Engineer Intern - PhD
  NYC +29 · Summer 2027
  Open posting
• Google
  Hardware Engineer Intern
  NYC +29 · Summer 2027
  Open posting
• GE Vernova
  Hardware Automation and Test Engineering Intern - Spring/Summer 2027
  Rochester, NY · Spring 2027
  Open posting
• GE Vernova
  Hardware Automation and Test Engineering Intern - Critical Infrastructure Communications
  Rochester, NY · Summer 2027
  Open posting
• Wonder
  Robotics Systems Engineer Intern
  New York, NY · Paid
  Open posting
• GE Vernova
  Hardware Engineer Intern - Critical Infrastructure Communications
  Rochester, NY · Spring 2027
  Open posting
• GE Vernova
  Hardware Engineer Co-op - Critical Infrastructure Communications
  Rochester, NY · Fall 2027 · co-op
  Open posting
• Hudson River Trading
  Hardware Engineer Intern
  NYC · Summer 2027
  Open posting
• AMD
  2027 Masters ASIC Package Engineering Co-op/Intern
  Fishkill, New York +7 · Summer 2027 · co-op
  Open posting
• AMD
  2027 Undergrad ASIC Package Engineering Co-op/Intern
  Fishkill, New York +15 · Summer 2027 · co-op
  Open posting
• AMD
  Hardware Design Verification Engineer Co-op/Intern
  Rochester, NY +6 · Summer 2027 · co-op
  Open posting
• AMD
  Firmware Engineer Intern/Co-op
  Rochester, NY +9 · Summer 2027 · co-op
  Open posting
• AMD
  Hardware Engineering Intern/Co-op - Undergrad
  Rochester, NY +5 · Summer 2027 · co-op
  Open posting
• AMD
  2027 Masters Hardware Engineering intern/co-op
  Rochester, New York +13 · Summer 2027 · co-op
  Open posting
• AMD
  2027 Undergrad Firmware Engineering Co-op/Intern
  Rochester, New York +8 · Summer 2027 · co-op
  Open posting
• AMD
  2027 Masters Firmware Engineering Intern/Co-op
  Fishkill, New York +8 · Summer 2027 · co-op
  Open posting
• AMD
  2027 Undergrad Hardware Engineering intern/co-op
  Fishkill, New York +7 · Summer 2027 · co-op
  Open posting
• AMD
  2027 Masters Hardware Design Verification Engineering Intern/Co-op
  Fishkill, New York +8 · Summer 2027 · co-op
  Open posting
• AMD
  2027 Undergrad Hadware Design Verification Engineering Intern/Co-Op
  Fishkill, New York +13 · Summer 2027 · co-op
  Open posting
• Jane Street
  Hardware Engineer (FPGA/ASIC) Intern
  New York, NY · Summer 2027
  Open posting
• Citadel Securities
  FPGA Engineer Intern
  NYC +1 · Fall 2026
  Open posting
• GE Aerospace
  Embedded Systems Engineer Co-op
  Long Island, New York · Spring 2027 · co-op
  Open posting
• D3 Embedded
  Embedded Systems Design Co-op
  West Henrietta, NY · co-op
  Open posting

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Updated September 26, 2026. Listings are collected from public job boards several times a day; always check the posting on the employer's site before applying.